Layer Count
From 2 to 12 layers, including HDI with laser microvias
From basic two-layer boards to complex 60-layer HDI with controlled impedance. We route traces considering component availability from our supply pipeline.
The classic problem: the circuit designer gets the customer BOM, creates an ideal topology, then procurement finds half the chips are on 26–40 week lead times. Re-layout = 2–4 weeks + validation + money. Our circuit designer sits in the same office as the component sourcing manager.
Send the schematic, Gerber files, or even just the BOM and a rough layout. We'll assess the scope and suggest the optimal layer count.
Our supply pipeline informs our PCB design. We route with components that are available, not hypothetical ones from a datasheet.
We check the design against the factory's real production parameters: minimum clearances, trace widths, hole ratios, and thermal zones. We generate Gerber, production order, and Pick&Place data, then submit the package for factory review before launch.
You receive production-ready Gerber files and a verified BOM. You can send them to your own factory or order through us.
If anything goes wrong at the factory — we help. We can call the fab, re-check the Gerber output, and correct issues.
From 2 to 12 layers, including HDI with laser microvias
Differential pair routing with specified impedance and length matching
Production-aware design with clearance and width rules matching the factory
Routing under 0.5 mm-pitch BGA packages with blind and buried vias
Gerber X2, ODB++, IPC-2581 — any format your fab requires
Attach the schematic, BOM, and any constraints. We'll estimate the layer count, manufacturing time, and cost.
