A reference guide to electronics terms for engineers, buyers, and managers.
- BOM (Bill of Materials)
- Bill of Materials — a complete list of components required to manufacture a printed circuit board or device.
- PCB (Printed Circuit Board)
- Printed Circuit Board — a dielectric substrate with conductive traces for connecting electronic components.
- HDI (High Density Interconnect)
- High Density Interconnect — multilayer boards with microvias for compact, high-performance devices.
- DFM (Design for Manufacturing)
- Design for Manufacturing — analyzing a design for producibility before releasing it to production.
- FPGA
- Field-Programmable Gate Array — a chip whose logic configuration is defined after manufacturing.
- Import Substitution
- Replacing foreign components and technologies with locally available equivalents without loss of functionality.
- BGA (Ball Grid Array)
- Ball Grid Array — a surface-mount package with solder ball contacts on the underside of the chip.
- RoHS
- Restriction of Hazardous Substances — a directive limiting lead, mercury, cadmium, and other hazardous substances in electronics.
